System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

Representing the most recent generation of double-data-rate (DDR) SDRAM memory, DDR4 and low-power LPDDR4 together provide improvements in speed, density, and power over DDR3. However, such speed and ...

The systems have increased test throughput by up to 75% over the original testers. Also, result reporting is easier thanks to a compact database that stores all test data. Lifeline Systems provides ...

Arthur Cao outlines how fresh approaches are needed to ensure tracker-based PV systems are designed adequately to avoid ...